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Capabilities

 

Mass Production

Rigid

Flex/Flex-Rigid

Layer Count
 
Finished Board Thickness
 
 
Max. Production Panel Size
 
Min. Line Width/ Line Space
 
 
Min. Hole Size
Mechanical
Laser
Max. Aspect/ratio
 
Laminate
Main Brands:
Shengyi, KB, Ventec, Nanya, ITEQ
 
 
 
 
 
Solder Mask Color
Main brands:
Tamura, Taiyo, OTC, Huntsman
 
 
 
Surface Finish
 
 
 
 
 
 
 
 
 
Profiling
 
 
 
Lead Time
 
 
Special Technology

 

• 1 - 58 layer
 
• 0.4 - 3.2 mm
• > 3.2 mm on request
 
• 450 mm x 600 mm
 
• 0.01/0.01mm for base copper Hoz and final Cu thickness 0.053mm
 
 
• 0.25 mm
• 0.1 mm
• 8:1
 
• CEM-1
• CEM-3
• FR-4
• Anti CAF
• Halogen free (RoHS compliance)
• BT epoxy
• PTFE Ceramic
• Rogers
 
• Green (shiny / semi-matte / matte)
• Blue
• Black
• White
• Red
 
• HAL Sn100CL (leadfree)
• Chemical Nickel Gold
• Electro Nickel Gold
• Chemical Tin
• Chemical Silver
• OSP
• Carbon print
• Peelable solder mask
• Resin plugging
 
• Routing
• Punching
• V-scoring / Jump V-scoring
 
• Express service: 15 days (FCA HK)
• Mass Production: 4 - 6 weeks (FCA HK)
 
• HDI boards (micro vias, buried vias)
• Press fit holes
Sample Fabrication
 
Layer Count
 
Max Production Panel
 
Laminate
Shengyi / Ventec
 
 
 
 
 
Finished Board Thickness
 
Base Copper Thickness
 
Min. Finished Hole Size
 
Min. Line Width / Spacing
 
Profiling
 
 
 
LPI Solder Mask Color
 
 
 
 
 
Surface Finish
 
• 1 – 8 Layers
 
• 457mm x 610mm
 
• CEM-1
• CEM-3
• FR-4
• FR4 TG 170
• CTI600
• Anti CAF
 
• 0.4mm – 3.2mm
 
• 18 – 105µm
 
• 0.2mm finished (mechanical drilling)
 
• 0.1 / 0.1 mm
 
• Routing, Depth routing
• Punching
• V-scoring / Jump V-scoring
 
• Green (shiny / semi-matte / matte)
• Blue
• Black
• White
• Red
 
• HAL Sn100CL (lead-free)
• Chemical Nickel / Gold (max. gold
   thickness = 0.1 µm)
• Electro Nickel / Gold (max. gold thickness of Gold Finger = 1.5 µm)
• Chemical Tin
• Chemical Silver
• OSP
• Carbon print
• Peelable mask
• Resin plugging (max. hole size = 0.5mm)
Layer Count
 
Finished Board Thickness
 
 
Max. Production Panel Size
 
 
 
Laminate
Main Brands:
PI = APlus, Taiflex, Thinflex
FR4 = Shengyi
Coverlay = APlus, Taiflex
 
 
Solder Mask Color
Main Brands:
Taiyo (UL approved)
 
 
 
 
Surface Finish
 
 
 
 
 
 
 
 
 
 
Profiling
 
 
 
Lead Time
 
 
Stiffener
 
 
 
• Rigid-Flex 10 Layer, Flex 8 Layer
 
• Rigid-Flex: 0.2 – 3.2 mm
• Flex: 0.15 – 1.0 mm
 
• 250mm x 1000mm (2L)
• 250mm x 500 mm (ML)
 
 
• FR-4
• Halogen free
• PI CCL material
• PET CCL material
• Coverlay
• PI-CCL on Aluminum
 
• Green
• Yellow
• Amber
• Blue
• Black
• White
 
• HAL
• HAL LF
• ENIG
• Electro Nickel Gold
• Chemical Tin
• Tin Plating
• Gold Finger
• Chemical Silver
• OSP
• Carbon Ink Print
 
• Punching
• Laser Cutting
• Routing
 
• Express service: 4 days (FCA HK)
• Mass Production: 4 - 5 weeks (FCA HK)
 
• PSA (pressure sensitive adhesive)
• TSA (thermal sensitive adhesive)
• Materials: FR4, Al, PI
 

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